Heat dissipating device for a semiconductor package



FIG. 1 is a front view of an embodiment of the heat dissipating device;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2;

FIG. 7 is a sectional view taken along section line 7--7 in FIG. 2; and,

FIG. 8 is a view of the heat dissipating device shown in FIG. 1 attached to a semiconductor package, the latter being shown by broken lines only as it does not form any part of the claimed design. 

The ornamental design for a heat dissipating device for a semiconductor package, as shown and desscribed. 